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LAM TCP 9400 PTX Silicon Trench Etch Process Monitoring for Fault Detection and Classification Teina Pardue Teina.Pardue fairchildsemi.com Fairchild Semiconductor 3333 West 9000 South West Jordan.

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How to fill out the Lam 9400 online

The Lam 9400 form is a crucial document for monitoring fault detection and classification in the Silicon Trench etching process. This guide aims to provide clear and comprehensive instructions to help users effectively complete the form online, regardless of their level of experience.

Follow the steps to fill out the Lam 9400 online.

  1. Press the ‘Get Form’ button to access the Lam 9400 form and open it in your browser.
  2. Begin by filling in the section that requests basic information about the process and tool used. Input the specific details regarding the Lam TCP 9400 PTX tool and the type of Silicon trench process being implemented.
  3. In the multi-step recipe section, outline the phases of your etching process, specifying breakthrough and main etch stages. Ensure clarity and accuracy in describing each step.
  4. Provide detailed observations related to the main etch stability, efficiency of the Wafer-less Auto Clean, and preventive maintenance checks, focusing on parameters like electron collision rate.
  5. Document any additional information regarding the effects of varying process conditions and potential tool faults. This should include observations from the fault detection and classification sections.
  6. Review the filled sections for accuracy and completeness, making sure all required information has been provided.
  7. Once you have filled out all relevant sections, save your changes to the document. You can download, print, or share the Lam 9400 form as needed.

Complete your Lam 9400 form online today for efficient process monitoring!

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Step 1: process gases are broken into chemically reactive species in plasma; Step 2: diffusion of reactive species to substrate surface; Step 3: absorption of reactive species onto material layer; Step 4: reaction between reactive species and material layer; Step 5: desorption of reaction by-products; Step 6: diffusion ...

In general, there are two classes of etching processes: Wet etching where the material is dissolved when immersed in a chemical solution. Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant.

The etch rate of undoped polysilicon has a value of 714 Ã…/min in HBr/He plasma without O2. Then, the etch rate of undoped polysilicon first increases and decreases gradually when O2 is added to HBr/He plasma.

There are two basic etching technologies used today: wet and dry. Both utilize corrosion as the reactive force in the etching process – the difference is wet etching uses chemical solutions while dry etching uses gases.

Etching to create a pattern on a substrate. In semiconductor device fabrication, etching refers to any technology that will selectively remove material from a thin film on a substrate (with or without prior structures on its surface) and by this removal create a pattern of that material on the substrate.

Poly etch. Poly Etch Is a high purity acid blend used for controlled silicon etching.

The basic process is simple: 1) Expose the wafer to the etchant. 2) The etchant interacts chemically and/or physically with the wafer surface. 3) The material produced from this interaction is removed from the surface.

The wet etch process can be described by three basic steps (1) Diffusion of the liquid etchant to the structure that is to be removed. (2) The reaction between the liquid etchant and the material being etched away. A reduction-oxidation (redox) reaction usually occurs.

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© Copyright 1997-2025
airSlate Legal Forms, Inc.
3720 Flowood Dr, Flowood, Mississippi 39232
Form Packages
Adoption
Bankruptcy
Contractors
Divorce
Home Sales
Employment
Identity Theft
Incorporation
Landlord Tenant
Living Trust
Name Change
Personal Planning
Small Business
Wills & Estates
Packages A-Z
Form Categories
Affidavits
Bankruptcy
Bill of Sale
Corporate - LLC
Divorce
Employment
Identity Theft
Internet Technology
Landlord Tenant
Living Wills
Name Change
Power of Attorney
Real Estate
Small Estates
Wills
All Forms
Forms A-Z
Form Library
Customer Service
Your Privacy Choices
Terms of Service
Privacy Notice
Legal Hub
Content Takedown Policy
Bug Bounty Program
About Us
Help Portal
Legal Resources
Blog
Affiliates
Contact Us
Delete My Account
Site Map
Industries
Forms in Spanish
Localized Forms
State-specific Forms
Forms Kit
Legal Guides
Real Estate Handbook
All Guides
Prepared for You
Notarize
Incorporation services
Our Customers
For Consumers
For Small Business
For Attorneys
Our Sites
US Legal Forms
USLegal
FormsPass
pdfFiller
signNow
altaFlow
DocHub
Instapage
Social Media
Call us now toll free:
+1 833 426 79 33
As seen in:
  • USA Today logo picture
  • CBC News logo picture
  • LA Times logo picture
  • The Washington Post logo picture
  • AP logo picture
  • Forbes logo picture
© Copyright 1997-2025
airSlate Legal Forms, Inc.
3720 Flowood Dr, Flowood, Mississippi 39232