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JEDEC STANDARDCustomer Notification of Product/Process Changes by SolidState SuppliersJESD46D (Revision of JESD46C, October 2006)DECEMBER 2011JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONNOTICE JEDEC standards.

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How to fill out the JEDEC STANDARD - ECIA online

This guide provides users with a clear and supportive walkthrough on how to fill out the JEDEC STANDARD - ECIA online. Whether you are familiar with digital document management or new to it, this guide aims to assist you in completing the form accurately and efficiently.

Follow the steps to complete the JEDEC STANDARD - ECIA form online.

  1. Select the ‘Get Form’ button to access the document and open it within your preferred online platform.
  2. Begin by filling out the scope of the document, ensuring you clearly understand the solid-state products and associated processes covered by the form.
  3. Enter the terms and definitions relevant to your submission. It is vital to accurately classify product or process changes as either major or minor according to JEDEC guidelines.
  4. Document the customer notification requirements. Specify how affected customers will be identified and how they will be notified about the changes.
  5. Detail the proposed First Ship Date and any anticipated effects the changes may have on product quality and reliability.
  6. Include all relevant information in the Product and Process Change Notification section, such as the PCN tracking number, customer part number, and a detailed description of the changes.
  7. Review all filled sections to ensure that all information is accurate and adheres to JEDEC standards. Confirm that the documentation is complete before proceeding.
  8. Once the form is complete, you can save changes. Choose to download, print, or share the form as necessary, ensuring that it is shared with the appropriate stakeholders.

Complete your documents online now to ensure compliance with JEDEC standards.

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The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered.

The IPC J-STD-001 standard for Requirements for Soldered Electrical and Electronic Assemblies has emerged as the pre-eminent authority for military defence and commercial electronics manufacturing.

IPC JEDEC J-STD-075A outlines a process to classify and label non-semiconductor electronic component's Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry's classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid ...

The purpose of this standard is to identify the classification level of nonhermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

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