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JEDEC STANDARD Descriptive Designation System for Semiconductordevice Packages JESD30E (Revision of JESD30D, July 2006) SEPTEMBER 2008 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards.

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How to fill out the Descriptive Designation System for Electronic-device Packages - JEDEC online

This guide provides clear and detailed instructions on how to fill out the Descriptive Designation System for Electronic-device Packages, commonly referred to as JEDEC. By following these steps, users can effectively complete the form online, ensuring accurate communication of semiconductor-device package specifications.

Follow the steps to accurately complete the JEDEC form.

  1. Press the ‘Get Form’ button to access the form, which will open it in an online editor for you to begin entering your information.
  2. Begin with the mandatory package-body material code. This should be the first field you complete, identifying the predominant material composition of the package.
  3. Next, fill in the three-letter basic package designator, which combines a two-letter package outline style code with either a preceding terminal-position code or a succeeding lead-form code.
  4. Proceed to describe package-specific features using appropriate prefixes based on the function and characteristics, separated by a dash from the previous fields.
  5. Add any package differentiator suffixes if needed. This includes Arabic numerals that further define specifics beyond the code already provided.
  6. Include a terminal-count suffix to indicate the number of terminals present on the device package. If necessary, specify additional information using parentheses.
  7. If applicable, append a supplemental-information field starting with a slash (/). This field may reference nominal package dimensions or outline drawings relevant to the package.
  8. Once all the fields are completed accurately, ensure to save your changes. You can then download, print, or share the completed form as needed.

Start filling out the JEDEC form online today to ensure your semiconductor-device package specifications are communicated effectively.

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© Copyright 1997-2025
airSlate Legal Forms, Inc.
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Form Packages
Adoption
Bankruptcy
Contractors
Divorce
Home Sales
Employment
Identity Theft
Incorporation
Landlord Tenant
Living Trust
Name Change
Personal Planning
Small Business
Wills & Estates
Packages A-Z
Form Categories
Affidavits
Bankruptcy
Bill of Sale
Corporate - LLC
Divorce
Employment
Identity Theft
Internet Technology
Landlord Tenant
Living Wills
Name Change
Power of Attorney
Real Estate
Small Estates
Wills
All Forms
Forms A-Z
Form Library
Customer Service
Terms of Service
Privacy Notice
Legal Hub
Content Takedown Policy
Bug Bounty Program
About Us
Help Portal
Legal Resources
Blog
Affiliates
Contact Us
Delete My Account
Site Map
Industries
Forms in Spanish
Localized Forms
State-specific Forms
Forms Kit
Legal Guides
Real Estate Handbook
All Guides
Prepared for You
Notarize
Incorporation services
Our Customers
For Consumers
For Small Business
For Attorneys
Our Sites
US Legal Forms
USLegal
FormsPass
pdfFiller
signNow
altaFlow
DocHub
Instapage
Social Media
Call us now toll free:
+1 833 426 79 33
As seen in:
  • USA Today logo picture
  • CBC News logo picture
  • LA Times logo picture
  • The Washington Post logo picture
  • AP logo picture
  • Forbes logo picture
© Copyright 1997-2025
airSlate Legal Forms, Inc.
3720 Flowood Dr, Flowood, Mississippi 39232