Get Interposer Technology:

The active interposer integrates: Flexible system interconnect topologies between all chiplets for scalable cache-coherency support. Energy-efficient 3D-plugs for dense high-throughput, inter-layer communication, and. A memory-IO controller and the physical layer (PHY) for socket communication.

For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. ... They also are positioned as an alternative to 2.5D packages using silicon interposers.

For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. ... They also are positioned as an alternative to 2.5D packages using silicon interposers.

Abstract: Silicon interposers are a technology with a history of multiple incarnations over more than 20 years. Today, interposers with TSVs are considered an alternative to 3D IC structures where die are stacked on top of each other using TSVs.

An interposer is an electrical interface routing between one socket or connection to another. ... Interposer comes from the Latin word "interp nere", meaning "to put between". They are often used in BGA packages, multi-chip modules and High Bandwidth Memory.

The active interposer integrates: Flexible system interconnect topologies between all chiplets for scalable cache-coherency support. Energy-efficient 3D-plugs for dense high-throughput, inter-layer communication, and. A memory-IO controller and the physical layer (PHY) for socket communication.

FAQs. What is an interposer? Interposers are substrates that are used to attach components as an intermediate step to directly attaching to the main/motherboard. The interposer then becomes the new package for attaching onto the circuit board.

High-Density Circuit Substrate. HomeProductsSubstratePackage Substrate. The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board, and protects expensive semiconductors from external stress.