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JEDEC STANDARD Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature JESD22-B112A (Revision of JESD22-B112, May 2005) OCTOBER 2009 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.

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Maximum permissible package warpage of BGA is given 80 % of the maximum relative displacement that does not cause open solder joints or solder bridges. The other 20 % of the displacement is reserved for a tolerance of the PWB warpage and the fluctuation of the paste thickness.

Warpage is calculated by dividing the actual measured amount that the tile deviates from flatness by the length of the edge or diagonal, then multiplying by 100 to get a percentage.

PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE. The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

JESD-22 is a series of uniform methods and procedures for evaluating the reliability of packaged solid state devices. JESD-22 establishes the physical, electrical, mechanical, and environmental conditions under which these packaged devices are to be tested.

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© Copyright 1997-2025
airSlate Legal Forms, Inc.
3720 Flowood Dr, Flowood, Mississippi 39232
Form Packages
Adoption
Bankruptcy
Contractors
Divorce
Home Sales
Employment
Identity Theft
Incorporation
Landlord Tenant
Living Trust
Name Change
Personal Planning
Small Business
Wills & Estates
Packages A-Z
Form Categories
Affidavits
Bankruptcy
Bill of Sale
Corporate - LLC
Divorce
Employment
Identity Theft
Internet Technology
Landlord Tenant
Living Wills
Name Change
Power of Attorney
Real Estate
Small Estates
Wills
All Forms
Forms A-Z
Form Library
Customer Service
Terms of Service
DMCA Policy
About Us
Blog
Affiliates
Contact Us
Privacy Notice
Delete My Account
Site Map
All Forms
Search all Forms
Industries
Forms in Spanish
Localized Forms
Legal Guides
Real Estate Handbook
All Guides
Prepared for You
Notarize
Incorporation services
Our Customers
For Consumers
For Small Business
For Attorneys
Our Sites
US Legal Forms
USLegal
FormsPass
pdfFiller
signNow
airSlate workflows
DocHub
Instapage
Social Media
Call us now toll free:
1-877-389-0141
As seen in:
  • USA Today logo picture
  • CBC News logo picture
  • LA Times logo picture
  • The Washington Post logo picture
  • AP logo picture
  • Forbes logo picture
© Copyright 1997-2025
airSlate Legal Forms, Inc.
3720 Flowood Dr, Flowood, Mississippi 39232