Get J Std 020b

If baking is required, devices should be baked for a minimum of 8 hours at 125ºC. 1. Any unused devices after the MBB has been opened for more than 48 hours or not stored at <10% RH should be baked before any subsequent reflow and board assembly. 2.

The MSL is an electronic industry rating that describes how long a moisture sensitive device can be exposed to ambient room conditions (approximately 30°C and 60% Relative Humidity) prior to being soldered in place.

J-STD-020F The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components.

An IPC/JEDEC Standard J-STD-020 MSL 2a rating means: 1. These components are sensitive to moisture. 2. Once these components are removed from the moisture barrier bag packaging at factory ambient temperature of ≤ 30 °C/60 % RH, they must be assembled within 4 weeks from the date the bag was opened.

The purpose of this standard is to identify the classification level of nonhermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

An IPC/JEDEC Standard J-STD-020 MSL 2a rating means: 1. These components are sensitive to moisture. 2. Once these components are removed from the moisture barrier bag packaging at factory ambient temperature of ≤ 30 °C/60 % RH, they must be assembled within 4 weeks from the date the bag was opened.