Get Jesd22 B106

Filling out the Jesd22 B106 online can seem daunting, but with this step-by-step guide, you will be able to navigate the process with ease. This document outlines important testing procedures for solid state devices, and proper completion of the form ensures compliance and clarity.

Follow the steps to fill out the Jesd22 B106 form successfully.

1. Click ‘Get Form’ button to obtain the form and open it in the editor.
2. Begin by reviewing the scope section of the form, which details the purpose of the test method. Ensure you understand the requirements for testing the resistance to soldering temperature for through-hole mounted devices.
3. In the apparatus section, check the specifications for the solder pot and dipping device. Ensure you have the appropriate equipment to meet the criteria outlined in the document.
4. Follow the materials section to select the correct solder. Confirm whether you will be using leaded or lead-free solder, as specified by industry standards.
5. Proceed to the procedure section, taking note of the special preparation of specimens. Document any specific preparations that are required before testing.
6. Prepare the solder bath as instructed, ensuring the molten solder is at the correct temperature and properly stirred.
7. Detail the solder dip process, including the rates of immersion and emersion, as well as the dwell time in the solder bath. Record the exact measurements needed to comply with the guidelines.
8. After conducting the solder dip, complete the measurements section by documenting hermeticity tests, visual inspections, and electrical measurements according to the specifications.
9. Evaluate the criteria for failure as described to ensure all devices meet the necessary standards before final submissions.
10. Review all entries for accuracy. Save changes, download, or print the completed form before sharing it with relevant parties.

For further assistance and to complete your document submissions online, please follow the guidelines outlined in this guide.